PUMD2,125
vs
PUMD2/A2,165
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
|
| Pin Count |
6
|
|
| Manufacturer Package Code |
SOT363
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
| DC Current Gain-Min (hFE) |
60
|
60
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
2
|
2
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
NPN AND PNP
|
NPN AND PNP
|
| Power Dissipation-Max (Abs) |
0.3 W
|
0.2 W
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
1
|
|
|
|
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