PUMD16
vs
PIMD2,115
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
DC Current Gain-Min (hFE) |
80
|
60
|
JESD-609 Code |
e3
|
e3
|
Number of Elements |
2
|
2
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity/Channel Type |
NPN AND PNP
|
NPN AND PNP
|
Power Dissipation-Max (Abs) |
0.3 W
|
0.6 W
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
TIN
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
TSOP
|
Package Description |
|
PLASTIC, SC-74, 6 PIN
|
Pin Count |
|
6
|
Manufacturer Package Code |
|
SOT457
|
Factory Lead Time |
|
4 Weeks
|
Additional Feature |
|
BUILT-IN BIAS RESISTOR RATIO IS 1
|
Collector-Emitter Voltage-Max |
|
50 V
|
Configuration |
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
JESD-30 Code |
|
R-PDSO-G6
|
Moisture Sensitivity Level |
|
1
|
Number of Terminals |
|
6
|
Operating Temperature-Max |
|
150 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Qualification Status |
|
Not Qualified
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transistor Application |
|
SWITCHING
|
|
|
|
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