PUMD16,115
vs
PEMD16
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
|
Package Description |
PLASTIC, SC-88, 6 PIN
|
|
Pin Count |
6
|
|
Manufacturer Package Code |
SOT363
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
BUILT-IN BIAS RESISTOR RATIO IS 2.1
|
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
50 V
|
|
Configuration |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
|
DC Current Gain-Min (hFE) |
80
|
80
|
JESD-30 Code |
R-PDSO-G6
|
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
2
|
2
|
Number of Terminals |
6
|
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity/Channel Type |
NPN AND PNP
|
NPN AND PNP
|
Power Dissipation-Max (Abs) |
0.3 W
|
0.3 W
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
|
Terminal Form |
GULL WING
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
3
|
|
|
|
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