PUMB11,115 vs BRC144EMP feature comparison

PUMB11,115 NXP Semiconductors

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BRC144EMP Renesas Electronics Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS TECHNOLOGY CORP
Part Package Code TSSOP
Package Description PLASTIC, SC-88, 6 PIN SMALL OUTLINE, R-PDSO-G3
Pin Count 6 3
Manufacturer Package Code SOT363
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Additional Feature BUILT IN BIAS RESISTOR RATIO IS 1 BUILT IN BIAS RESISTOR RATIO IS 1
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 50 V 50 V
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE) 30 70
JESD-30 Code R-PDSO-G6 R-PDSO-G3
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 2 1
Number of Terminals 6 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type PNP NPN
Power Dissipation-Max (Abs) 0.3 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2

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