PUMA2S4000M-45
vs
MCM6209P20
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
APTA GROUP INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
PGA, PGA66,11X11
|
DIP, DIP28,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
45 ns
|
20 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-XPGA-P66
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
4194304 bit
|
262144 bit
|
| Memory IC Type |
SRAM MODULE
|
STANDARD SRAM
|
| Memory Width |
32
|
4
|
| Number of Terminals |
66
|
28
|
| Number of Words |
131072 words
|
65536 words
|
| Number of Words Code |
128000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
128KX32
|
64KX4
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
PGA
|
DIP
|
| Package Equivalence Code |
PGA66,11X11
|
DIP28,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.008 A
|
0.02 A
|
| Standby Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Current-Max |
0.48 mA
|
0.145 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
PIN/PEG
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
DUAL
|
| Base Number Matches |
2
|
3
|
| Power Supplies |
|
5 V
|
|
|
|