PSD813F1A-12UI
vs
PSD813F1-12J
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
WAFERSCALE INTEGRATION INC
|
Part Package Code |
QFP
|
|
Package Description |
TQFP-64
|
PLASTIC, LDCC-52
|
Pin Count |
64
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G64
|
S-PQCC-J52
|
JESD-609 Code |
e3/e4
|
|
Length |
14 mm
|
|
Number of I/O Lines |
27
|
27
|
Number of Ports |
4
|
4
|
Number of Terminals |
64
|
52
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
|
Package Equivalence Code |
QFP64,.6SQ,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.54 mm
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN/NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
14 mm
|
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
1
|
1
|
Clock Frequency-Max |
|
26.3 MHz
|
|
|
|
Compare PSD813F1A-12UI with alternatives
Compare PSD813F1-12J with alternatives