PSD813F1-12JI vs PSD813F1A-12UI feature comparison

PSD813F1-12JI Waferscale Integration Inc

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PSD813F1A-12UI STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC STMICROELECTRONICS
Package Description PLASTIC, LDCC-52 TQFP-64
Reach Compliance Code unknown unknown
Clock Frequency-Max 26.3 MHz
External Data Bus Width 16 16
JESD-30 Code S-PQCC-J52 S-PQFP-G64
Number of I/O Lines 27 27
Number of Ports 4 4
Number of Terminals 52 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND GULL WING
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 2 2
Rohs Code Yes
Part Package Code QFP
Pin Count 64
ECCN Code EAR99
HTS Code 8542.39.00.01
JESD-609 Code e3/e4
Length 14 mm
Package Code LQFP
Package Equivalence Code QFP64,.6SQ,32
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.54 mm
Terminal Finish MATTE TIN/NICKEL PALLADIUM GOLD
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

Compare PSD813F1-12JI with alternatives

Compare PSD813F1A-12UI with alternatives