PSD813F1-12JI
vs
PSD813F1A-12UI
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WAFERSCALE INTEGRATION INC
|
STMICROELECTRONICS
|
Package Description |
PLASTIC, LDCC-52
|
TQFP-64
|
Reach Compliance Code |
unknown
|
unknown
|
Clock Frequency-Max |
26.3 MHz
|
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQCC-J52
|
S-PQFP-G64
|
Number of I/O Lines |
27
|
27
|
Number of Ports |
4
|
4
|
Number of Terminals |
52
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Position |
QUAD
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QFP
|
Pin Count |
|
64
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e3/e4
|
Length |
|
14 mm
|
Package Code |
|
LQFP
|
Package Equivalence Code |
|
QFP64,.6SQ,32
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.54 mm
|
Terminal Finish |
|
MATTE TIN/NICKEL PALLADIUM GOLD
|
Terminal Pitch |
|
0.8 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
14 mm
|
|
|
|
Compare PSD813F1-12JI with alternatives
Compare PSD813F1A-12UI with alternatives