PRIXP425BB
vs
EWIXP425BDT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEL CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
BGA,
LEAD FREE, PLASTIC, BGA-492
Pin Count
492
492
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33.33 MHz
33.33 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B492
S-PBGA-B492
JESD-609 Code
e1
e1
Length
35 mm
35 mm
Low Power Mode
NO
NO
Number of Terminals
492
492
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
2.59 mm
2.59 mm
Speed
533 MHz
533 MHz
Supply Voltage-Max
1.365 V
1.365 V
Supply Voltage-Min
1.235 V
1.235 V
Supply Voltage-Nom
1.3 V
1.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Pbfree Code
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
40
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