PPC8568CVTANGGA
vs
MPC8567EVTANGGA
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
BGA,
|
BGA,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
166 MHz
|
166 MHz
|
External Data Bus Width |
|
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B1023
|
S-PBGA-B1023
|
JESD-609 Code |
e2
|
e2
|
Length |
33 mm
|
33 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
1023
|
1023
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.75 mm
|
2.75 mm
|
Speed |
800 MHz
|
800 MHz
|
Supply Voltage-Max |
1.155 V
|
1.155 V
|
Supply Voltage-Min |
1.045 V
|
1.045 V
|
Supply Voltage-Nom |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER
|
TIN SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
33 mm
|
33 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
2
|
|
|
|
Compare PPC8568CVTANGGA with alternatives
Compare MPC8567EVTANGGA with alternatives