PPC7448VU1250NC vs MC7448HX1250NC feature comparison

PPC7448VU1250NC NXP Semiconductors

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MC7448HX1250NC Freescale Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description LGA, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 1250 MHz 1250 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CBGA-N360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code LGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Speed 1250 MHz 1250 MHz
Supply Voltage-Max 1.15 V 1.15 V
Supply Voltage-Min 1.05 V 1.05 V
Supply Voltage-Nom 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form NO LEAD BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Rohs Code No
Part Package Code BGA
Pin Count 360
Additional Feature LOW POWER TAKEN FROM SLEEP MODE
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code BGA360,19X19,50
Peak Reflow Temperature (Cel) 245
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC7448HX1250NC with alternatives