PPC7448HX1000LC
vs
MPC8541EVTAJFX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
LOW POWER TAKEN FROM SLEEP MODE
Address Bus Width
36
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
200 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-B360
Length
25 mm
Low Power Mode
YES
Number of Terminals
360
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.8 mm
Speed
1000 MHz
Supply Voltage-Max
1.2 V
Supply Voltage-Min
1.1 V
Supply Voltage-Nom
1.15 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
2
2
Compare PPC7448HX1000LC with alternatives
Compare MPC8541EVTAJFX with alternatives