PPC440GX-3RF667C
vs
PPC440GX-3NF667E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
APPLIED MICRO CIRCUITS CORP
APPLIED MICRO CIRCUITS CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA552,24X24,40
BGA, BGA552,24X24,40
Pin Count
552
552
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
64
64
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83 MHz
83 MHz
External Data Bus Width
64
64
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B552
S-PBGA-B552
Length
25 mm
25 mm
Low Power Mode
NO
NO
Number of Terminals
552
552
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA552,24X24,40
BGA552,24X24,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.977 mm
3.977 mm
Speed
667 MHz
667 MHz
Supply Current-Max
2200 mA
2200 mA
Supply Voltage-Max
1.6 V
1.6 V
Supply Voltage-Min
1.5 V
1.5 V
Supply Voltage-Nom
1.55 V
1.55 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
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