PPC405GPR3DB400Z
vs
PPC405GPR-3DB400
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
APPLIED MICRO CIRCUITS CORP
APPLIED MICRO CIRCUITS CORP
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA456,26X26,40
Pin Count
456
456
Reach Compliance Code
compliant
compliant
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
66.66 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
456
456
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.65 mm
Speed
400 MHz
400 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
1.85 V
1.85 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
JESD-609 Code
e0
Package Equivalence Code
BGA456,26X26,40
Terminal Finish
TIN LEAD
Compare PPC405GPR3DB400Z with alternatives
Compare PPC405GPR-3DB400 with alternatives