PPC405EXR-SSD400T
vs
STPCD0112BTC3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
STMICROELECTRONICS
Package Description
27 X 27 MM, ROHS COMPLIANT, PLASTIC, MS-034C, EBGA-388
35 X 35 MM, PLASTIC, BGA-388
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
NO
Clock Frequency-Max
666.66 MHz
120 MHz
External Data Bus Width
64
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
388
388
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.38 mm
Speed
400 MHz
120 MHz
Supply Voltage-Max
1.3 V
3.6 V
Supply Voltage-Min
1.2 V
3 V
Supply Voltage-Nom
1.25 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
388
JESD-609 Code
e0
Package Equivalence Code
BGA388,26X26,50
Terminal Finish
TIN LEAD
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