PPC405EXR-SSD400T
vs
MCF5482CVR166
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Not Recommended
|
Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
|
Pin Count |
388
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
666.66 MHz
|
66.67 MHz
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B388
|
S-PBGA-B388
|
Length |
27 mm
|
27 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
388
|
388
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
2.55 mm
|
Speed |
400 MHz
|
166.66 MHz
|
Supply Voltage-Max |
1.3 V
|
3.6 V
|
Supply Voltage-Min |
1.2 V
|
3 V
|
Supply Voltage-Nom |
1.25 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
Width |
27 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
13 Weeks
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
|
|
Compare PPC405EXR-SSD400T with alternatives
Compare MCF5482CVR166 with alternatives