PPC405EX-SSB333TZ
vs
STPCD0112BTC3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
APPLIED MICRO CIRCUITS CORP
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
BGA,
35 X 35 MM, PLASTIC, BGA-388
Pin Count
388
388
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
NO
Clock Frequency-Max
666.66 MHz
120 MHz
External Data Bus Width
64
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
388
388
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.38 mm
Speed
333 MHz
120 MHz
Supply Voltage-Max
1.3 V
3.6 V
Supply Voltage-Min
1.1 V
3 V
Supply Voltage-Nom
1.2 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
1
JESD-609 Code
e0
Package Equivalence Code
BGA388,26X26,50
Terminal Finish
TIN LEAD
Compare PPC405EX-SSB333TZ with alternatives
Compare STPCD0112BTC3 with alternatives