PPC405EX-SPA333TZ
vs
MCF5474VR266
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
APPLIED MICRO CIRCUITS CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
TEPBGA-388
Pin Count
388
388
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
5A992
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
666.66 MHz
66.67 MHz
External Data Bus Width
32
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
388
388
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.55 mm
Speed
333 MHz
266.66 MHz
Supply Voltage-Max
1.3 V
1.58 V
Supply Voltage-Min
1.1 V
1.43 V
Supply Voltage-Nom
1.2 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
3
Pbfree Code
Rohs Code
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of DMA Channels
16
Number of Serial I/Os
4
On Chip Data RAM Width
8
Package Equivalence Code
BGA388,26X26,40
Peak Reflow Temperature (Cel)
260
RAM (words)
32768
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
40
Compare PPC405EX-SPA333TZ with alternatives
Compare MCF5474VR266 with alternatives