PNM2010H9762BSBS
vs
P-2010H9762AGWI
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.30
|
8533.21.00.30
|
| Additional Feature |
LASER TRIMMABLE, NON INDUCTIVE, PRECISION
|
ANTI-SULFUR, FLAME PROOF, NON-INDUCTIVE
|
| Construction |
Rectangular
|
Rectangular
|
| JESD-609 Code |
e1
|
e4
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.8382 mm
|
0.8382 mm
|
| Package Length |
5.842 mm
|
5.3086 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.905 mm
|
2.4892 mm
|
| Packing Method |
Bulk
|
WAFFLE PACK
|
| Rated Power Dissipation (P) |
0.8 W
|
0.8 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistance |
97600 Ω
|
97600 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2010
|
2010
|
| Surface Mount |
YES
|
YES
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
50 ppm/°C
|
50 ppm/°C
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Gold (Au) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
0.1%
|
0.05%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare PNM2010H9762BSBS with alternatives
Compare P-2010H9762AGWI with alternatives