PN7150B0HN/C11006Y
vs
PN7150B0HN/C11002Y
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Package Description |
HVQFN-40
|
|
| Reach Compliance Code |
compliant
|
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
S-XQCC-N40
|
|
| JESD-609 Code |
e4
|
|
| Length |
6 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
40
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-30 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVQCCN
|
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max |
1.95 V
|
|
| Supply Voltage-Min |
1.65 V
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6 mm
|
|
| uPs/uCs/Peripheral ICs Type |
NFC CONTROLLER
|
|
| Base Number Matches |
1
|
|
|
|
|