PMN48XP,115
vs
FDC638P
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
TSOP
|
SOT
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
SOT457
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
Drain Current-Max (ID) |
4.1 A
|
4.5 A
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
Power Dissipation-Max (Abs) |
1.28 W
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
3
|
Pbfree Code |
|
Yes
|
Package Description |
|
LEAD FREE, SUPERSOT-6
|
DS Breakdown Voltage-Min |
|
20 V
|
Drain-source On Resistance-Max |
|
0.048 Ω
|
JESD-30 Code |
|
R-PDSO-G6
|
Number of Terminals |
|
6
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Qualification Status |
|
COMMERCIAL
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
|
|
|
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