PMN27UN,135
vs
U401
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
TSOP
Package Description
PLASTIC, SC-74, TSOP-6
CYLINDRICAL, O-MBCY-W6
Pin Count
6
Manufacturer Package Code
SOT457
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
Factory Lead Time
4 Weeks
Configuration
SINGLE WITH BUILT-IN DIODE
SEPARATE, 2 ELEMENTS
DS Breakdown Voltage-Min
20 V
Drain Current-Max (ID)
5.7 A
Drain-source On Resistance-Max
0.04 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
JUNCTION
JESD-30 Code
R-PDSO-G6
O-MBCY-W6
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
Number of Elements
1
2
Number of Terminals
6
6
Operating Mode
ENHANCEMENT MODE
DEPLETION MODE
Operating Temperature-Max
150 °C
200 °C
Package Body Material
PLASTIC/EPOXY
METAL
Package Shape
RECTANGULAR
ROUND
Package Style
SMALL OUTLINE
CYLINDRICAL
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
1.75 W
0.3 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
NO
Terminal Finish
TIN
TIN LEAD
Terminal Form
GULL WING
WIRE
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
11
JEDEC-95 Code
TO-71
Compare PMN27UN,135 with alternatives
Compare U401 with alternatives