PMEG6010ELR
vs
PMEG6010ETR/S500
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Package Description
PLASTIC PACKAGE-2
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Samacsys Manufacturer
NXP
Application
GENERAL PURPOSE
EFFICIENCY
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
R-PDSO-F2
R-PDSO-F2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Power Dissipation-Max
0.68 W
0.68 W
Reference Standard
AEC-Q101; IEC-60134
AEC-Q101; IEC-60134
Rep Pk Reverse Voltage-Max
60 V
60 V
Reverse Recovery Time-Max
0.0045 µs
0.0044 µs
Surface Mount
YES
YES
Technology
SCHOTTKY
SCHOTTKY
Terminal Finish
Tin (Sn)
TIN
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Base Number Matches
2
1
HTS Code
8541.10.00.80
Additional Feature
LOW LEAKAGE CURRENT
Forward Voltage-Max (VF)
0.53 V
Non-rep Pk Forward Current-Max
50 A
Output Current-Max
1 A
Reverse Current-Max
60 µA
Reverse Test Voltage
60 V
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