PMEG6010ELR
vs
PMEG6010ETR/S500
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
| Package Description |
PLASTIC PACKAGE-2
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
NXP
|
|
| Application |
GENERAL PURPOSE
|
EFFICIENCY
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F2
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Dissipation-Max |
0.68 W
|
0.68 W
|
| Reference Standard |
AEC-Q101; IEC-60134
|
AEC-Q101; IEC-60134
|
| Rep Pk Reverse Voltage-Max |
60 V
|
60 V
|
| Reverse Recovery Time-Max |
0.0045 µs
|
0.0044 µs
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
Tin (Sn)
|
TIN
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8541.10.00.80
|
| Additional Feature |
|
LOW LEAKAGE CURRENT
|
| Forward Voltage-Max (VF) |
|
0.53 V
|
| Non-rep Pk Forward Current-Max |
|
50 A
|
| Output Current-Max |
|
1 A
|
| Reverse Current-Max |
|
60 µA
|
| Reverse Test Voltage |
|
60 V
|
|
|
|
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