PMBTA13,215
vs
CMPTA13TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
CENTRAL SEMICONDUCTOR CORP
Part Package Code
TO-236
Package Description
PLASTIC PACKAGE-3
Pin Count
3
Manufacturer Package Code
SOT23
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.21.00.75
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Collector Current-Max (IC)
0.5 A
0.5 A
Configuration
DARLINGTON
DARLINGTON
DC Current Gain-Min (hFE)
10000
10000
JEDEC-95 Code
TO-236AB
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.5 W
0.35 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
125 MHz
125 MHz
VCEsat-Max
1.5 V
1.5 V
Base Number Matches
2
1
Pbfree Code
Compare PMBTA13,215 with alternatives
Compare CMPTA13TR with alternatives