PMBT3904,235
vs
2N5089G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TO-236
|
TO-92
|
| Package Description |
PLASTIC PACKAGE-3
|
LEAD FREE, CASE 29-11, TO-226AA, 3 PIN
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
SOT23
|
CASE 29-11
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.21.00.75
|
|
| Factory Lead Time |
4 Weeks
|
|
| Collector Current-Max (IC) |
0.2 A
|
0.05 A
|
| Collector-Base Capacitance-Max |
4 pF
|
|
| Collector-Emitter Voltage-Max |
40 V
|
25 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
30
|
450
|
| JEDEC-95 Code |
TO-236AB
|
TO-92
|
| JESD-30 Code |
R-PDSO-G3
|
O-PBCY-T3
|
| JESD-609 Code |
e3
|
e1
|
| Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
0.25 W
|
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Transistor Application |
SWITCHING
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
300 MHz
|
50 MHz
|
| Turn-off Time-Max (toff) |
250 ns
|
|
| Turn-on Time-Max (ton) |
70 ns
|
|
| VCEsat-Max |
0.3 V
|
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
|
|
|
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