PMBFJ175,215
vs
MMBF5115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
TO-236
Package Description
PLASTIC, SMD, SOT-23, 3 PIN
SMALL OUTLINE, R-PDSO-G3
Pin Count
3
Manufacturer Package Code
SOT23
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.21.00.95
Samacsys Manufacturer
NXP
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
30 V
Drain-source On Resistance-Max
125 Ω
FET Technology
JUNCTION
JUNCTION
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
DEPLETION MODE
DEPLETION MODE
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
P-CHANNEL
P-CHANNEL
Power Dissipation-Max (Abs)
0.3 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Feedback Cap-Max (Crss)
7 pF
JEDEC-95 Code
TO-236AB
Compare PMBFJ175,215 with alternatives
Compare MMBF5115 with alternatives