PMBD914,235
vs
SMBD6050
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INFINEON TECHNOLOGIES AG
|
Part Package Code |
TO-236
|
|
Package Description |
PLASTIC PACKAGE-3
|
|
Pin Count |
3
|
|
Manufacturer Package Code |
SOT23
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1 V
|
1.1 V
|
JEDEC-95 Code |
TO-236AB
|
|
JESD-30 Code |
R-PDSO-G3
|
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
|
Non-rep Pk Forward Current-Max |
0.5 A
|
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
3
|
|
Operating Temperature-Max |
150 °C
|
|
Output Current-Max |
0.215 A
|
0.25 A
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Dissipation-Max |
0.25 W
|
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
100 V
|
70 V
|
Reverse Current-Max |
5 µA
|
|
Reverse Recovery Time-Max |
0.004 µs
|
0.01 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
2
|
|
|
|
Compare PMBD914,235 with alternatives
-
PMBD914,235 vs 933856870215
-
PMBD914,235 vs PMBD914/T4
-
PMBD914,235 vs PMBD914212
-
PMBD914,235 vs SMBD914E6433
-
PMBD914,235 vs 933856870235
-
PMBD914,235 vs PMBD914,215
-
PMBD914,235 vs PMBD914/T3
-
PMBD914,235 vs PMBD914-T
-
PMBD914,235 vs PMBD914
Compare SMBD6050 with alternatives