PM4328-PI
vs
PM8316-PI
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PMC-SIERRA INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
23 X 23 MM, 2.28 MM HEIGHT, PLASTIC, BGA-324
|
23 X 23 MM, 2.33 MM HEIGHT, PLASTIC, BGA-324
|
| Reach Compliance Code |
compliant
|
compliant
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| JESD-609 Code |
e0
|
e0
|
| Length |
23 mm
|
23 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
324
|
324
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA324,22X22,40
|
BGA324,22X22,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.22 mm
|
1.75 mm
|
| Supply Current-Max |
270 mA
|
500 mA
|
| Supply Voltage-Nom |
2.5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
23 mm
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare PM4328-PI with alternatives
Compare PM8316-PI with alternatives