PLUS16L8DN
vs
PAL16L8-10/BRA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PHILIPS COMPONENTS
ADVANCED MICRO DEVICES INC
Package Description
DIP-20
DIP, DIP20,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
SECURITY FUSE
PAL
JESD-30 Code
R-PDIP-T20
R-CDIP-T20
Number of Dedicated Inputs
10
10
Number of I/O Lines
6
6
Number of Terminals
20
20
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
10 DEDICATED INPUTS, 6 I/O
10 DEDICATED INPUTS, 6 I/O
Output Function
COMBINATORIAL
COMBINATORIAL
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
10 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Rohs Code
No
Part Package Code
DIP
Pin Count
20
ECCN Code
3A001.A.2.C
Architecture
PAL-TYPE
JESD-609 Code
e0
Length
24.257 mm
Number of Inputs
16
Number of Outputs
8
Number of Product Terms
64
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare PLUS16L8DN with alternatives
Compare PAL16L8-10/BRA with alternatives