PLDC18G8-20WI vs EP330-25MJB feature comparison

PLDC18G8-20WI Cypress Semiconductor

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EP330-25MJB Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Part Package Code DIP
Package Description 0.300 INCH, WINDOWED, CERDIP-20 DIP, DIP20,.3
Pin Count 20
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 33.3 MHz 22 MHz
JESD-30 Code R-GDIP-T20 R-XDIP-T20
JESD-609 Code e0
Length 24.13 mm
Number of Dedicated Inputs 8
Number of I/O Lines 8
Number of Inputs 18 18
Number of Outputs 8 8
Number of Product Terms 72 72
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8 DEDICATED INPUTS, 8 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code WDIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Programmable Logic Type UV PLD
Propagation Delay 20 ns 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2
ECCN Code 3A001.A.2.C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level 38535Q/M;38534H;883B
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare PLDC18G8-20WI with alternatives

Compare EP330-25MJB with alternatives