PLB2224
vs
DS33X81+W
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
|
Package Description |
PLASTIC, BGA-272
|
BGA,
|
Pin Count |
272
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
|
Length |
27 mm
|
17 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
272
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA272,20X20,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.35 mm
|
1.82 mm
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare PLB2224 with alternatives
Compare DS33X81+W with alternatives