PL138-58OC
vs
PL138-48QI-R
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
GREEN, MO-153AC, TSSOP-20
|
QFN-16
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ALSO OPERATES AT -2.375 TO -3.8 V SUPPLY
|
ALSO OPERATES AT -2.375 TO -3.8 V SUPPLY
|
Family |
PL138
|
PL138
|
Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
JESD-30 Code |
R-PDSO-G20
|
R-XQCC-N16
|
Length |
6.5 mm
|
3.5 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
20
|
16
|
Number of True Outputs |
8
|
8
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
HVQCCN
|
Package Equivalence Code |
TSSOP20,.25
|
LCC16,.12X.14,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TUBE
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
0.94 ns
|
0.79 ns
|
Same Edge Skew-Max (tskwd) |
0.037 ns
|
0.037 ns
|
Seated Height-Max |
1.2 mm
|
0.9 mm
|
Supply Voltage-Max (Vsup) |
3.63 V
|
3.8 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
4.4 mm
|
3 mm
|
fmax-Min |
266 MHz
|
800 MHz
|
Base Number Matches |
1
|
1
|
|
|
|
Compare PL138-58OC with alternatives
Compare PL138-48QI-R with alternatives