PIC32MZ2064DAB169-I/HF
vs
PIC32MZ2064DAB169-I/6J
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Not Recommended
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Has ADC |
YES
|
|
Address Bus Width |
24
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
CPU Family |
PIC32
|
|
Clock Frequency-Max |
64 MHz
|
|
DAC Channels |
NO
|
|
DMA Channels |
YES
|
|
External Data Bus Width |
16
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B169
|
|
JESD-609 Code |
e1
|
|
Length |
11 mm
|
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
8
|
|
Number of External Interrupts |
5
|
|
Number of I/O Lines |
120
|
|
Number of Serial I/Os |
3
|
|
Number of Terminals |
169
|
|
Number of Timers |
13
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LFBGA
|
|
Package Equivalence Code |
BGA169,13X13,16
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
ROM (words) |
2048
|
|
ROM Programmability |
FLASH
|
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.4 mm
|
|
Speed |
200 MHz
|
|
Supply Current-Max |
300 mA
|
|
Supply Voltage-Max |
1.9 V
|
|
Supply Voltage-Min |
1.7 V
|
|
Supply Voltage-Nom |
1.8 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
11 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare PIC32MZ2064DAB169-I/HF with alternatives
Compare PIC32MZ2064DAB169-I/6J with alternatives