PIC32MZ2025DAR169T-I/6J vs PIC32MZ2025DAR169T-I/6JX feature comparison

PIC32MZ2025DAR169T-I/6J Microchip Technology Inc

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PIC32MZ2025DAR169T-I/6JX Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description LFBGA-169 LFBGA-169
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 5 Weeks
Samacsys Manufacturer Microchip
Has ADC YES YES
Address Bus Width 24 24
Bit Size 32 32
Boundary Scan YES
CPU Family PIC32
Clock Frequency-Max 64 MHz 64 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width 16 16
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B169 S-PBGA-B169
Length 11 mm 11 mm
Low Power Mode YES
Number of DMA Channels 8
Number of External Interrupts 5
Number of I/O Lines 120 120
Number of Terminals 169 169
Number of Timers 12
On Chip Data RAM Width 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
RAM (bytes) 262144
RAM (words) 262144
ROM (words) 2097152 2097152
ROM Programmability FLASH FLASH
Screening Level TS 16949 TS 16949
Seated Height-Max 1.56 mm 1.56 mm
Speed 200 MHz 200 MHz
Supply Current-Max 172 mA
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11 mm 11 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 1
Date Of Intro 2019-03-27

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