PIC32MZ1024EFG064T-250I/MR
vs
PIC32MZ1024EFG064-250I/MR
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-64
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
NO
|
| CPU Family |
PIC32
|
PIC32
|
| Clock Frequency-Max |
64 MHz
|
64 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
| Length |
9 mm
|
9 mm
|
| Number of DMA Channels |
8
|
8
|
| Number of I/O Lines |
46
|
46
|
| Number of Terminals |
64
|
64
|
| Number of Timers |
9
|
9
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| ROM (words) |
1048576
|
1048576
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Speed |
252 MHz
|
252 MHz
|
| Supply Voltage-Max |
3.3 V
|
3.6 V
|
| Supply Voltage-Min |
2.1 V
|
2.1 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2018-06-12
|
|
|
|
Compare PIC32MZ1024EFG064T-250I/MR with alternatives
Compare PIC32MZ1024EFG064-250I/MR with alternatives