PIC32MX664F128LBG
vs
PIC32MX664F128L-I/BG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
10 X 10 MM, 1.10 MM HEIGHT, BGA-121
TFBGA-121
Pin Count
121
121
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
32
Clock Frequency-Max
18 MHz
50 MHz
DAC Channels
NO
NO
DMA Channels
NO
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B121
S-PBGA-B121
Length
10 mm
10 mm
Number of I/O Lines
26
83
Number of Terminals
121
121
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
1.2 mm
Speed
18 MHz
80 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.3 V
2.3 V
Supply Voltage-Nom
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Rohs Code
ECCN Code
3A991.A.2
Factory Lead Time
4 Weeks
Date Of Intro
2016-09-20
Samacsys Manufacturer
Microchip
Boundary Scan
YES
CPU Family
PIC32
Format
FIXED POINT
Integrated Cache
YES
JESD-609 Code
e1
Low Power Mode
YES
Number of DMA Channels
8
Number of External Interrupts
5
Number of Timers
5
On Chip Data RAM Width
8
On Chip Program ROM Width
8
RAM (bytes)
32768
RAM (words)
32768
ROM (words)
143360
Screening Level
TS 16949
Supply Current-Max
98 mA
Terminal Finish
TIN SILVER COPPER
Compare PIC32MX664F128LBG with alternatives
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