PIC32MX664F128L-I/PT
vs
PIC32MX664F128L-V/BG
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFP
Package Description
TQFP-100
TFBGA-121
Pin Count
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
6 Weeks
7 Weeks
Date Of Intro
2016-09-20
2016-09-20
Samacsys Manufacturer
Microchip
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
CPU Family
PIC32
PIC32
Clock Frequency-Max
50 MHz
50 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PQFP-G100
S-PBGA-B121
JESD-609 Code
e3
e1
Length
12 mm
10 mm
Low Power Mode
YES
YES
Number of DMA Channels
8
8
Number of External Interrupts
5
5
Number of I/O Lines
83
83
Number of Terminals
100
121
Number of Timers
5
5
On Chip Data RAM Width
8
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFQFP
TFBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
RAM (bytes)
32768
32768
RAM (words)
32768
32768
ROM (words)
143360
143360
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
AEC-Q100; TS 16949
Seated Height-Max
1.2 mm
1.2 mm
Speed
80 MHz
80 MHz
Supply Current-Max
98 mA
120 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.3 V
2.3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.4 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Width
12 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
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