PIC32MX550F256HT-I/PT
vs
PIC32MX550F256H-V/MR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TQFP-64
|
QFN-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
6 Weeks
|
7 Weeks
|
| Date Of Intro |
2017-10-13
|
2016-04-14
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
3KB BOOT FLASH AVAILABLE
|
3KB BOOT FLASH AVAILABLE
|
| Address Bus Width |
16
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| CPU Family |
PIC32
|
PIC32
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQCC-N64
|
| Length |
10 mm
|
9 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
4
|
8
|
| Number of External Interrupts |
5
|
5
|
| Number of I/O Lines |
49
|
49
|
| Number of Terminals |
64
|
64
|
| Number of Timers |
7
|
5
|
| On Chip Data RAM Width |
32
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
HVQCCN
|
| Package Equivalence Code |
TQFP64,.47SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| RAM (bytes) |
32768
|
32768
|
| RAM (words) |
8192
|
32768
|
| ROM (words) |
262144
|
262144
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Speed |
50 MHz
|
40 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
2.3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
10 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Format |
|
FIXED POINT
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Supply Current-Max |
|
32 mA
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare PIC32MX550F256HT-I/PT with alternatives
Compare PIC32MX550F256H-V/MR with alternatives