PIC32MX170F256D-50V/ML
vs
PIC32MX170F256DT-50V/TL
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFN-44
|
VTLA-44
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2016-04-11
|
2016-04-11
|
Has ADC |
YES
|
YES
|
Additional Feature |
AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY
|
AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-N44
|
S-XBCC-B44
|
Length |
8 mm
|
6 mm
|
Number of I/O Lines |
35
|
35
|
Number of Terminals |
44
|
44
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVBCC
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
RAM (bytes) |
65536
|
65536
|
ROM (words) |
262144
|
262144
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1 mm
|
1 mm
|
Speed |
50 MHz
|
50 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.3 V
|
2.3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
BUTT
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
8 mm
|
6 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare PIC32MX170F256D-50V/ML with alternatives
Compare PIC32MX170F256DT-50V/TL with alternatives