PIC24FJ192GB106T-I/PT
vs
DSPIC33FJ32GP302-I/TSP
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFP
DIP
Package Description
10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-64
0.300 INCH, LEAD FREE, PLASTIC, DIP-28
Pin Count
64
28
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
Additional Feature
ALSO OPERATES AT 2V MINIMUM SUPPLY FOR 16 MHZ
Address Bus Width
Bit Size
16
16
CPU Family
PIC
Clock Frequency-Max
32 MHz
40 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G64
R-PDIP-T28
JESD-609 Code
e3
e3
Length
10 mm
34.671 mm
Moisture Sensitivity Level
1
Number of I/O Lines
53
Number of Terminals
64
28
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFQFP
DIP
Package Equivalence Code
TQFP64,.47SQ
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
16384
ROM (words)
196608
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
5.08 mm
Speed
32 MHz
Supply Current-Max
24 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
10 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Compare PIC24FJ192GB106T-I/PT with alternatives
Compare DSPIC33FJ32GP302-I/TSP with alternatives