PIC24FJ128GA106-E/MR
vs
DSPIC33FJ32GP302-E/TSP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
DIP
|
| Pin Count |
64
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
7 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Has ADC |
YES
|
|
| Address Bus Width |
24
|
|
| Bit Size |
16
|
16
|
| Boundary Scan |
YES
|
|
| CPU Family |
PIC24
|
|
| Clock Frequency-Max |
32 MHz
|
40 MHz
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PQCC-N64
|
R-PDIP-T28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
9 mm
|
34.671 mm
|
| Low Power Mode |
NO
|
|
| Number of External Interrupts |
5
|
|
| Number of I/O Lines |
53
|
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
64
|
28
|
| Number of Timers |
5
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
DIP
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
16384
|
|
| ROM (words) |
131072
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
5.08 mm
|
| Speed |
32 MHz
|
|
| Supply Current-Max |
24 mA
|
|
| Supply Voltage-Max |
2.75 V
|
3.6 V
|
| Supply Voltage-Min |
2 V
|
3 V
|
| Supply Voltage-Nom |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
9 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
0.300 INCH, LEAD FREE, PLASTIC, DIP-28
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare PIC24FJ128GA106-E/MR with alternatives
Compare DSPIC33FJ32GP302-E/TSP with alternatives