PIC24EP128GP202T-E/MM
vs
DSPIC33EP512MC206-E/MR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
|
Package Description |
6 X 6 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-28
|
9 X 9 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-64
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Address Bus Width |
|
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
60 MHz
|
60 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-N28
|
S-PQCC-N64
|
JESD-609 Code |
e3
|
e3
|
Length |
6 mm
|
9 mm
|
Number of DMA Channels |
4
|
4
|
Number of Terminals |
28
|
64
|
Number of Timers |
5
|
5
|
On Chip Program ROM Width |
24
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC28,.24SQ,25
|
LCC64,.35SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Current-Max |
55 mA
|
55 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
6 mm
|
9 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
7 Weeks
|
Barrel Shifter |
|
YES
|
Boundary Scan |
|
YES
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
NO
|
Internal Bus Architecture |
|
MULTIPLE
|
Low Power Mode |
|
YES
|
Moisture Sensitivity Level |
|
3
|
Number of External Interrupts |
|
3
|
On Chip Data RAM Width |
|
8
|
Peak Reflow Temperature (Cel) |
|
260
|
RAM (words) |
|
49152
|
Screening Level |
|
AEC-Q100; TS 16949
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare PIC24EP128GP202T-E/MM with alternatives
Compare DSPIC33EP512MC206-E/MR with alternatives