PIC18LF26J13-E/ML
vs
PIC18LF26J13-I/SO
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
QFN-28
|
SOIC-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 2 V MINIMUM SUPPLY AT 8 MHZ
|
ALSO OPERATES AT 2 V MINIMUM SUPPLY AT 8 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
48 MHz
|
48 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N28
|
R-PDSO-G28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
6 mm
|
17.9 mm
|
| Number of I/O Lines |
24
|
24
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
2.65 mm
|
| Speed |
48 MHz
|
48 MHz
|
| Supply Voltage-Max |
2.75 V
|
3.6 V
|
| Supply Voltage-Min |
2.35 V
|
2.5 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
6 mm
|
7.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
5 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Boundary Scan |
|
NO
|
| CPU Family |
|
PIC18
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| Number of DMA Channels |
|
2
|
| Number of External Interrupts |
|
4
|
| Number of Serial I/Os |
|
2
|
| Number of Timers |
|
10
|
| On Chip Data RAM Width |
|
8
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
SOP28,.4
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
3760
|
| ROM (words) |
|
65536
|
| Supply Current-Max |
|
15.1 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare PIC18LF26J13-E/ML with alternatives
Compare PIC18LF26J13-I/SO with alternatives