PIC17C756AT-33I/L vs PIC17C756-33I/P feature comparison

PIC17C756AT-33I/L Microchip Technology Inc

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PIC17C756-33I/P Microchip Technology Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code LCC DIP
Package Description PLASTIC, MO-047, LCC-68 0.750 INCH, PLASTIC, SDIP-64
Pin Count 68 64
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 33 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 16
JESD-30 Code S-PQCC-J68 R-PDIP-T64
JESD-609 Code e3
Length 24.23 mm 57.658 mm
Moisture Sensitivity Level 3
Number of I/O Lines 50 50
Number of Terminals 68 64
On Chip Program ROM Width 16 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ SDIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 902 902
ROM (words) 16384 16384
ROM Programmability OTPROM OTPROM
Seated Height-Max 4.57 mm 5.08 mm
Speed 33 MHz 33 MHz
Supply Voltage-Max 5.5 V 6 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 1.778 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 24.23 mm 19.05 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 4
CPU Family PIC
Package Equivalence Code SDIP64,.75
Supply Current-Max 50 mA

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