PIC17C756AT-33I/L vs PIC16C924-08/SP feature comparison

PIC17C756AT-33I/L Microchip Technology Inc

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PIC16C924-08/SP Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code LCC DIP
Package Description PLASTIC, MO-047, LCC-68 0.750 INCH, PLASTIC, SDIP-64
Pin Count 68 64
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 16
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 33 MHz 8 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8
JESD-30 Code S-PQCC-J68 R-PDIP-T64
JESD-609 Code e3 e3
Length 24.23 mm 57.658 mm
Moisture Sensitivity Level 3
Number of I/O Lines 50 51
Number of Terminals 68 64
On Chip Program ROM Width 16 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ SDIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 902 176
ROM (words) 16384 4096
ROM Programmability OTPROM OTPROM
Seated Height-Max 4.57 mm 5.08 mm
Speed 33 MHz 8 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 1.778 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 24.23 mm 19.05 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 1
CPU Family PIC
Package Equivalence Code SDIP64,.75
Supply Current-Max 7 mA

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