PIC17C752-33/JW
vs
PIC17C752-33I/SP
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
WINDOWED, CERDIP-68
|
0.750 INCH, SHRINK, PLASTIC, DIP-64
|
Pin Count |
68
|
64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
33 MHz
|
33 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
R-CDIP-T68
|
R-PDIP-T64
|
JESD-609 Code |
e3
|
e3
|
Number of I/O Lines |
50
|
50
|
Number of Terminals |
68
|
64
|
On Chip Program ROM Width |
16
|
16
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SDIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
678
|
454
|
ROM (words) |
8192
|
8192
|
ROM Programmability |
UVPROM
|
OTPROM
|
Speed |
33 MHz
|
8 MHz
|
Supply Current-Max |
50 mA
|
|
Supply Voltage-Max |
6 V
|
6 V
|
Supply Voltage-Min |
5 V
|
5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Length |
|
57.655 mm
|
Seated Height-Max |
|
5.08 mm
|
Terminal Pitch |
|
1.778 mm
|
Width |
|
19.05 mm
|
|
|
|
Compare PIC17C752-33/JW with alternatives
Compare PIC17C752-33I/SP with alternatives