PIC16LF1719-E/MV
vs
PIC16F1719-I/SS
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
UQFN-40
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
6 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Has ADC |
YES
|
|
Additional Feature |
OPERATES AT 1.8V MIN @ 16 MHZ
|
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
|
CPU Family |
PIC16
|
|
Clock Frequency-Max |
32 MHz
|
|
DAC Channels |
YES
|
|
DMA Channels |
NO
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
S-PQCC-N40
|
|
JESD-609 Code |
e3
|
|
Length |
5 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
1
|
|
Number of External Interrupts |
1
|
|
Number of I/O Lines |
36
|
|
Number of Serial I/Os |
1
|
|
Number of Terminals |
40
|
|
Number of Timers |
7
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
14
|
8
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVQCCN
|
|
Package Equivalence Code |
LCC40,.2SQ,16
|
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
RAM (bytes) |
2048
|
|
ROM (words) |
16384
|
28672
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
0.55 mm
|
|
Speed |
32 MHz
|
32 MHz
|
Supply Voltage-Max |
3.6 V
|
5.5 V
|
Supply Voltage-Min |
2.5 V
|
1.8 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.4 mm
|
|
Terminal Position |
QUAD
|
|
Width |
5 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare PIC16LF1719-E/MV with alternatives
Compare PIC16F1719-I/SS with alternatives