PIC16F877
vs
PIC16LF877-20/PT
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
1998-12-01
|
|
| JESD-609 Code |
e3
|
e3
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
125
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Package Description |
|
10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44
|
| Pin Count |
|
44
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| Clock Frequency-Max |
|
20 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQFP-G44
|
| Length |
|
10 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of I/O Lines |
|
33
|
| Number of Terminals |
|
44
|
| On Chip Program ROM Width |
|
14
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TQFP
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
368
|
| ROM (words) |
|
8192
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.2 mm
|
| Speed |
|
20 MHz
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
4.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
10 mm
|
|
|
|
Compare PIC16F877 with alternatives
Compare PIC16LF877-20/PT with alternatives