PIC16F1509T-E/MLVAO
vs
PIC16LF1509-I/ML
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-20
|
4 X 4 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ
|
ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 16 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N20
|
S-PQCC-N20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
4 mm
|
| Number of I/O Lines |
18
|
18
|
| Number of Terminals |
20
|
20
|
| On Chip Program ROM Width |
8
|
14
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| ROM (words) |
14336
|
8192
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
2.5 V
|
3.3 V
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
4 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
20
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| CPU Family |
|
PIC16
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
LCC20,.16SQ,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
512
|
| Supply Current-Max |
|
2.1 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare PIC16F1509T-E/MLVAO with alternatives
Compare PIC16LF1509-I/ML with alternatives