PIC16C765/SO
vs
PIC16C765-I/L
feature comparison
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
0.600 INCH, PLASTIC, MO-011, DIP-40
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
LPCC
|
| Pin Count |
|
44
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
6 Weeks
|
| Date Of Intro |
|
1999-10-20
|
| Samacsys Manufacturer |
|
Microchip
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| CPU Family |
|
PIC16
|
| Clock Frequency-Max |
|
24 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQCC-J44
|
| JESD-609 Code |
|
e3
|
| Length |
|
16.5862 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of I/O Lines |
|
30
|
| Number of Terminals |
|
44
|
| On Chip Program ROM Width |
|
14
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QCCJ
|
| Package Equivalence Code |
|
LDCC44,.7SQ
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
256
|
| ROM (words) |
|
8192
|
| ROM Programmability |
|
OTPROM
|
| Seated Height-Max |
|
4.57 mm
|
| Speed |
|
24 MHz
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
J BEND
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
16.5862 mm
|
|
|
|
Compare PIC16C765/SO with alternatives
Compare PIC16C765-I/L with alternatives