PIC16C620-I/JW
vs
PIC16C620-/JW
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
WDIP, DIP18,.3
|
WDIP, DIP18,.3
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
PIC
|
PIC
|
| Clock Frequency-Max |
20 MHz
|
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-GDIP-T18
|
R-CDIP-T18
|
| JESD-609 Code |
e3
|
e3
|
| Length |
22.987 mm
|
22.86 mm
|
| Number of I/O Lines |
13
|
13
|
| Number of Terminals |
18
|
18
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
WDIP
|
WDIP
|
| Package Equivalence Code |
DIP18,.3
|
DIP18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, WINDOW
|
IN-LINE, WINDOW
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
80
|
80
|
| ROM (words) |
512
|
512
|
| ROM Programmability |
UVPROM
|
OTPROM
|
| Seated Height-Max |
5.08 mm
|
4.95 mm
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Current-Max |
20 mA
|
20 mA
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
2
|
|
|
|